Generally, the substrate materials for printed boards can be divided into two categories: rigid substrate materials and flexible substrate materials. An important variety of general rigid substrate materials is copper clad laminates. It is made of Reinforeing Material, impregnated with resin adhesive, dried, cut, laminated, and then coated with copper foil, using steel plate as a mold, and processed by high temperature and high pressure forming in a hot press. Into. A prepreg for a general multilayer board is a semi-finished product of a copper clad laminate (mostly a glass cloth impregnated with a resin and dried).

There are many ways to classify copper clad laminates. Generally, according to different reinforcing materials of the board, it can be divided into five categories: paper base, glass fiber cloth base, composite base (CEM series), laminated multi-layer board base and special material base (ceramic, metal core base, etc.). If the classification is based on the resin adhesive used in the board, the common paper-based CCI. There are various types of phenolic resins (XPc, XxxPC, FR-1, FR-2, etc.), epoxy resins (FE-3), and polyester resins. The common glass fiber cloth based CCL has epoxy resin (FR-4, FR-5), which is a widely used type of glass fiber cloth. In addition, there are other special resins (glass fiber cloth, polyamide fiber, non-woven fabric, etc.): bismaleimide modified triazine resin (BT), polyimide resin (PI) , diphenylene ether resin (PPO), maleic anhydride imine - styrene resin (MS), polycyanate resin, polyolefin resin, and the like.

According to the flame retardant performance of CCL, it can be divided into two types: flame retardant (UL94-VO, UL94-V1) and non-flame retardant (UL94-HB). In the past one or two years, with the emphasis on environmental protection issues, a new type of CCL that does not contain bromine in flame retardant CCL can be called “green flame retardant cCL”. With the rapid development of electronic product technology, there are higher performance requirements for cCL. Therefore, from the performance classification of CCL, it is divided into general performance CCL, low dielectric constant CCL, high heat resistance CCL (normal board L is above 150 ° C), low thermal expansion coefficient CCL (usually used on package substrates) ) and other types.

With the development and continuous improvement of electronic technology, new requirements for printed circuit board materials are constantly being put forward, thereby promoting the continuous development of the standards for copper clad laminates. At present, the main standards of substrate materials are as follows.

1 Standard At present, China's standards for substrate materials are GB/T4721—4722 1992 and GB 4723—4725—1992. The copper-clad board standard in Taiwan of China is the CNS standard, which is based on the Japanese JIs standard. Released in the year.

2 Other standard main standards are: Japanese JIS standard, American ASTM, NEMA, MIL, IPc, ANSI, UL standard, British Bs standard, German DIN, VDE standard, French NFC, UTE standard, Canadian CSA standard , Australia's AS standards, FOCT standards of the former Soviet Union, international IEC standards, etc.

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